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2012-08-21 1 smbt3906...mmbt3906 pnp silicon switching transistors ? high dc current gain: 0.1 ma to 100 ma ? low collector-emitter saturation voltage ? for smbt3906s and smbt3906u: two (galvanic) internal isolated transistor with good matching in one package ? complementary types: smbt3904...mmbt3904 (npn) ? smbt3906s/ u: for orientation in reel see package information below ? pb-free (rohs compliant) package ? qualified according aec q101 type marking pin configuration package smbt3906/ mmbt3906 smbt3906s smbt3906u s2a s2a s2a 1=b 1=e1 1=e1 2=e 2=b1 2=b1 3=c 3=c2 3=c2 - 4=e2 4=e2 - 5=b2 5=b2 - 6=c1 6=c1 sot23 sot363 sc74 maximum ratings parameter symbol value unit collector-emitter voltage v ceo 40 v collector-base voltage v cbo 40 emitter-base voltage v ebo 6 collector current i c 200 ma total power dissipation- t s 71c, sot23, mmbt3906 t s 115c, sot363, mmbt3906s t s 107c, sc74, mmbt3906u p tot 330 250 330 mw junction temperature t j 150 c storage temperature t st g -65 ... 150
2012-08-21 2 smbt3906...mmbt3906 thermal resistance parameter symbol value unit junction - soldering point 1) smbt3906/ mmbt3906 smbt3906s smbt3906u r thjs 240 140 130 mw 1 for calculation of r thja please refer to application note an077 (thermal resistance calculation) electrical characteristics at t a = 25c, unless otherwise specified parameter symbol values unit min. typ. max. dc characteristics collector-emitter breakdown voltage i c = 1 ma, i b = 0 v (br)ceo 40 - - v collector-base breakdown voltage i c = 10 a, i e = 0 v (br)cbo 40 - - emitter-base breakdown voltage i e = 10 a, i c = 0 v (br)ebo 6 - - collector-base cutoff current v cb = 30 v, i e = 0 i cbo - - 50 na dc current gain 1) i c = 100 a, v ce = 1 v i c = 1 ma, v ce = 1 v i c = 10 ma, v ce = 1 v i c = 50 ma, v ce = 1 v i c = 100 ma, v ce = 1 v h fe 60 80 100 60 30 - - - - - - - 300 - - - collector-emitter saturation voltage 1) i c = 10 ma, i b = 1 ma i c = 50 ma, i b = 5 ma v cesat - - - - 0.25 0.4 v base emitter saturation voltage 1) i c = 10 ma, i b = 1 ma i c = 50 ma, i b = 5 ma v besat 0.65 - - - 0.85 0.95 1 pulse test: t < 300s; d < 2%
2012-08-21 3 smbt3906...mmbt3906 electrical characteristics at t a = 25c, unless otherwise specified parameter symbol values unit min. typ. max. ac characteristics transition frequency i c = 10 ma, v ce = 20 v, f = 100 mhz f t 250 - - mhz collector-base capacitance v cb = 5 v, f = 1 mhz c cb - - 3.5 pf emitter-base capacitance v eb = 0.5 v, f = 1 mhz c eb - - 10 delay time v cc = 3 v, i c = 10 ma, i b1 = 1 ma, v be(off) = 0.5 v t d - - 35 ns rise time v cc = 3 v, i c = 10 ma, i b1 = 1 ma, v be(off) = 0.5 v t r - - 35 storage time v cc = 3 v, i c = 10 ma, i b1 = i b2 = 1 ma t stg - - 225 fall time v cc = 3 v, i c = 10 ma, i b1 = i b2 = 1 ma t f - - 75 noise figure i c = 100 a, v ce = 5 v, f = 1 khz, ? f = 200 hz, r s = 1 k ? f - - 4 db
2012-08-21 4 smbt3906...mmbt3906 test circuit delay and rise time ehn00059 275 10 -3.0 v 0 +0.5 v <4.0 c -10.6 v d = 2% 300 <1.0 ? ? pf k ns ns storage and fall time ehn00060 275 10 -3.0 v 0 +9.1 v <4.0 pf c -10.9 v d = 2% 1n916 <1.0 ns t 1 s 500 10 t 1 ? ? k <<
2012-08-21 5 smbt3906...mmbt3906 dc current gain h fe = ? ( i c ) v ce = 1 v 10 -5 10 -4 10 -3 10 -2 10 -1 10 0 ma i c 1 10 2 10 3 10 h fe -55 c 25 c 125 c saturation voltage i c = ? ( v besat ; v cesat ) h fe = 10 ehp00767 2 0 v be sat c 10 1 10 0 5 v ma 0.2 0.4 0.6 0.8 1.0 1.2 ce sat v , 5 10 2 v be v ce collector-base capacitance c cb = ? ( v cb ) emitter-base capacitance c eb = ? ( v eb ) 0 4 8 12 16 v 22 c cb / c eb 1 1.5 2 2.5 3 3.5 4 4.5 5 5.5 6 6.5 7 pf 8 v cb / v eb ccb ceb total power dissipation p tot = ? ( t s ) smbt3906 0 15 30 45 60 75 90 105 120 c 150 t s 0 30 60 90 120 150 180 210 240 270 300 mw 360 p tot
2012-08-21 6 smbt3906...mmbt3906 total power dissipation p tot = ? ( t s ) smbt3906u 0 15 30 45 60 75 90 105 120 c 150 t s 0 30 60 90 120 150 180 210 240 270 300 mw 360 p tot total power dissipation p tot = ? ( t s ) smbt3906s 0 15 30 45 60 75 90 105 120 c 150 t s 0 25 50 75 100 125 150 175 200 225 250 mw 300 p tot permissible pulse load r thjs = ? ( t p ) smbt3906 10 -6 10 -5 10 -4 10 -3 10 -2 10 0 s t p -1 10 0 10 1 10 2 10 3 10 k/w r thjs d=0.5 0.2 0.1 0.05 0.02 0.01 0.005 0 permissible pulse load p totmax / p totdc = ? ( t p ) smbt3906 10 ehp00936 -6 0 10 5 d = 5 10 1 5 10 2 3 10 10 -5 10 -4 10 -3 10 -2 10 0 s 0 0.005 0.01 0.02 0.05 0.1 0.2 0.5 tot max tot p dc p p t t p = d t t p t
2012-08-21 7 smbt3906...mmbt3906 permissible puls load r thjs = ? ( t p ) smbt3906u 10 -6 10 -5 10 -4 10 -3 10 -2 10 0 s t p 0 10 1 10 2 10 3 10 k/w r thjs d=0.5 0.2 0.1 0.05 0.02 0.01 0.005 0 permissible pulse load p totmax / p totdc = ? ( t p ) smbt3906u 10 -6 10 -5 10 -4 10 -3 10 -2 10 0 s t p 0 10 1 10 2 10 p totmax / p totdc d=0 0.005 0.01 0.02 0.05 0.1 0.2 0.5 permissible pulse load r thjs = ? ( t p ) smbt3906s 10 -6 10 -5 10 -4 10 -3 10 -2 10 0 s t p -1 10 0 10 1 10 2 10 3 10 k/w r thjs 0.5 0.2 0.1 0.05 0.02 0.01 0.005 d = 0 permissible pulse load p totmax / p totdc = ? ( t p ) smbt3906s 10 -6 10 -5 10 -4 10 -3 10 -2 10 0 s t p 0 10 1 10 2 10 3 10 - p totmax / p totdc d = 0 0.005 0.01 0.02 0.05 0.1 0.2 0.5
2012-08-21 8 smbt3906...mmbt3906 storage time t stg = ? ( i c ) ehp00762 10 ma t c s 10 1 10 0 10 10 01 2 55 ns 3 10 10 2 10 3 h fe = 20 10 25 c 125 c 10 = 20 fe h delay time t d = ? ( i c ) rise time t r = ? ( i c ) ehp00772 10 ma t c r 10 1 10 0 10 10 01 2 55 ns r t t d , 3 10 5 d t 10 2 10 3 = 3 v cc v 0 v v = 2 v be 40 v 15 v h fe = 10 fall time t f = ? ( i c ) ehp00773 10 ma t c f 10 1 10 0 10 10 01 2 55 ns 3 10 5 10 2 10 3 h fe = 20 25 c 125 c cc v = 40 v = 10 fe h rise time t r = ? ( i c ) ehp00764 10 ma t c r 10 1 10 0 10 10 01 2 55 ns 3 10 10 2 10 3 25 c 125 c cc v = 40 v = 10 fe h
2012-08-21 9 smbt3906...mmbt3906 package sc74 package outline foot print standard packing 0.5 0.95 1.9 2.9 54 6 3 2 1 1.1 max. (0.35) (2.25) ?.2 2.9 b 0.2 +0.1 -0.05 0.35 pin 1 marking m b 6x 0.95 1.9 0.15 -0.06 +0.1 1.6 10? max. a ?.1 2.5 0.25 10? max. ?.1 ?.1 a 0.2 m 0.1 max. 2.7 4 3.15 pin 1 marking 8 0.2 1.15 reel ?80 mm = 3.000 pieces/reel reel ?30 mm = 10.000 pieces/reel for symmetric types no defined pin 1 orientation in reel. manufacturer 2005, june date code (year/month) bcw66h type code pin 1 marking laser marking marking layout (example) small variations in positioning of date code, type code and manufacture are possible.
2012-08-21 10 smbt3906...mmbt3906 package sot23 package outline foot print marking layout (example) standard packing reel ?80 mm = 3.000 pieces/reel reel ?30 mm = 10.000 pieces/reel eh s bcw66 type code pin 1 0.8 0.9 0.9 1.3 0.8 1.2 0.25 m bc 1.9 -0.05 +0.1 0.4 ?.1 2.9 0.95 c b 0...8? 0.2 a 0.1 max. 10? max. 0.08...0.15 1.3 ?.1 10? max. m 2.4 ?.15 ?.1 1 a 0.15 min. 1) 1) lead width can be 0.6 max. in dambar area 12 3 3.15 4 2.65 2.13 0.9 8 0.2 1.15 pin 1 manufacturer 2005, june date code (ym)
2012-08-21 11 smbt3906...mmbt3906 p ackage sot363 package outline foot print marking layout (example) standard packing reel ?80 mm = 3.000 pieces/reel reel ?30 mm = 10.000 pieces/reel for symmetric types no defined pin 1 orientation in reel. small variations in positioning of date code, type code and manufacture are possible. manufacturer 2005, june date code (year/month) bcr108s type code pin 1 marking laser marking 0.3 0.7 0.9 0.65 0.65 1.6 0.2 4 2.15 1.1 8 2.3 pin 1 marking +0.1 0.2 1 6 23 5 4 ?.2 2 +0.1 -0.05 0.15 ?.1 1.25 0.1 max. 0.9 ?.1 a -0.05 6x 0.1 m 0.65 0.65 2.1 ?.1 0.1 0.1 min. m 0.2 a pin 1 marking
2012-08-21 12 smbt3906...mmbt3906 edition 2009-11-16 published by infineon technologies ag 81726 munich, germany ? 2009 infineon technologies ag all rights reserved. legal disclaimer the information given in this document shall in no event be regarded as a guarantee of conditions or characteristics. with respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, infineon technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights of any third party. information for further information on technology, delivery terms and conditions and prices, please contact the nearest infineon technologies office ( ). warnings due to technical requirements, components may contain dangerous substances. for information on the types in question, please contact the nearest infineon technologies office. infineon technologies components may be used in life-support devices or systems only with the express written approval of infineon technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system or to affect the safety or effectiveness of that device or system. life support devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain and/or protect human life. if they fail, it is reasonable to assume that the health of the user or other persons may be endangered.

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